Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
Ansys collaboration to expand from single-die system-on-chip (SoC) to include Intel's embedded multi-die interconnect bridge (EMIB) assembly technology Ansys multiphysics analyses provide signoff ...
MOUNTAIN VIEW, Calif., April 24, 2023 /PRNewswire/ -- Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. (Nasdaq: SNPS) ...
ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs ...
Ansys, Intel Foundry Collaborate on Multiphysics Analysis Solution for EMIB 2.5D Assembly Technology
Ansys (ANSS) electro-thermal analysis tools address novel physics requirements for signoff verification of multi-chip HPC, graphics, and AI applications / Key Highlights Ansys collaboration to expand ...
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