Dataweek

ESE’s solder paste printer now available in SA

Engineered for high-speed, high-accuracy applications, the ESE ES-FA1 solder paste printer eliminates the traditional bottlenecks of manual stencil changes and paste management, making it an ideal ...
IEEE

Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology

Abstract: We bonded 70μm-thick Si chip and PI substrate with anisotropic solder paste (ASP) using laser-assisted bonding (LAB). ASP contains 5 vol.% of Sn/58Bi type 5, 6 vol.% of nonconductive PMMA ...
IEEE

Investigation of properties of the SAC solder paste with the silver nanoparticle and carbon nanotube additives and the nano solder joints

Abstract: Several nanomaterials like silver nanoparticles and carbon nanotubes were obtained and their size and microstructure were investigated. The silver nanoparticles were characterized by ...